- Manufacturer：
-
- CUI Devices (4)
- Ohmite (32)
- Wakefield-Vette (20)
- Material：
-
- Width：
-
- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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58 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | 1 |
40,448
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
Ohmite | 1 |
22,587
In-stock
|
Get Quote | |||
|
|
Ohmite | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
Wakefield-Vette | 1 |
30,653
In-stock
|
Get Quote | |||
|
|
Wakefield-Vette | 1 |
42,458
In-stock
|
Get Quote | |||
|
|
Ohmite | 1 |
12,739
In-stock
|
Get Quote | |||
|
|
Ohmite | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
Ohmite | 1 |
26,235
In-stock
|
Get Quote | |||
|
|
Wakefield-Vette | 1 |
19,038
In-stock
|
Get Quote |
