- Manufacturer：
-
- CUI Devices (4)
- Ohmite (10)
- Material：
-
- Attachment Method：
-
- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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28 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | 1 |
14,608
In-stock
|
Get Quote | |||
|
|
Ohmite | 1 |
8,992
In-stock
|
Get Quote | |||
|
|
Ohmite | 1 |
5,278
In-stock
|
Get Quote | |||
|
|
Ohmite | 1 |
7,334
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
12,021
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
42,066
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
8,500
In-stock
|
Get Quote |
