- Manufacturer：
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- CUI Devices (6)
- Wakefield-Vette (4)
- Product Status：
-
- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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42 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
6,595
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
5,167
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
27,295
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
20,489
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
14,091
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
9,138
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
43,584
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
27,808
In-stock
|
Get Quote | |||
|
|
NTE Electronics, Inc | 1 |
44,940
In-stock
|
Get Quote | |||
|
|
Wakefield-Vette | 1 |
8,500
In-stock
|
Get Quote |
