- Manufacturer：
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- CUI Devices (2)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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10 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
34,121
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
13,638
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
28,784
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
5,888
In-stock
|
Get Quote | |||
|
|
Adafruit Industries LLC | 1 |
8,500
In-stock
|
Get Quote |
