Product Status:
Power Dissipation @ Temperature Rise:
Image Part Manufacturer Description MOQ Stock Action
ATS-55270W-C1-R0 Advanced Thermal Solutions Inc.
HEAT SINK 27MM X 27MM X 24.5MM
1
RFQ
47,272
In-stock
Get Quote
BGAH190-090E Ohmite
BGA HEATSINK W/TAPE
1
RFQ
8,500
In-stock
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ATS-51290K-C1-R0 Advanced Thermal Solutions Inc.
HEAT SINK 29MM X 29MM X 14.5MM
1
RFQ
31,123
In-stock
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ATS-50400B-C1-R0 Advanced Thermal Solutions Inc.
HEAT SINK 40MM X 40MM X 7.5MM
1
RFQ
8,500
In-stock
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HSB11-252518 CUI Devices
HEAT SINK, BGA, 25 X 25 X 18 MM
1
RFQ
11,103
In-stock
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HSB19-272718 CUI Devices
HEAT SINK, BGA, 27 X 27 X 18 MM
1
RFQ
8,500
In-stock
Get Quote
ATS-55450K-C1-R0 Advanced Thermal Solutions Inc.
HEAT SINK 45MM X 45MM X 14.5MM
1
RFQ
8,500
In-stock
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ATS-EXL65-300-R0 Advanced Thermal Solutions Inc.
HEATSINK AL6063 300X25X25MM
1
RFQ
8,500
In-stock
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ATS-50290G-C1-R0 Advanced Thermal Solutions Inc.
HEAT SINK 29MM X 29MM X 12.5MM
1
RFQ
8,500
In-stock
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ATS-EXL113-1220-R0 Advanced Thermal Solutions Inc.
PCIE EXTRUSION PROFILE, AL6063
1
RFQ
8,500
In-stock
Get Quote
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