- Manufacturer：
-
- Brainboxes (2)
- Comair Rotron (14)
- CUI Devices (8)
- Ohmite (2)
- Wakefield-Vette (38)
- Product Status：
-
- Shape：
-
- Length：
-
- Width：
-
- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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180 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
50,176
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
22,187
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
17,049
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
14,770
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
11,591
In-stock
|
Get Quote | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
35,603
In-stock
|
Get Quote | |||
|
|
Wakefield-Vette | 1 |
18,509
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
8,398
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
7,070
In-stock
|
Get Quote | |||
|
|
Wakefield-Vette | 1 |
49,353
In-stock
|
Get Quote |
