- Manufacturer：
-
- CUI Devices (4)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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18 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
34,851
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
35,590
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
5,360
In-stock
|
Get Quote | |||
|
|
Assmann WSW Components | 1 |
25,140
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
26,805
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
11,549
In-stock
|
Get Quote | |||
|
|
TE Application Tooling | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
TE Application Tooling | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
TE Application Tooling | 1 |
8,500
In-stock
|
Get Quote |
