- Manufacturer：
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- CUI Devices (4)
- Wakefield-Vette (4)
- Product Status：
-
- Material：
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- Shape：
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- Length：
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- Width：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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34 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
40,802
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
12,670
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
23,431
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
t-Global Technology | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
t-Global Technology | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
8,500
In-stock
|
Get Quote | |||
|
|
Wakefield-Vette | 1 |
8,500
In-stock
|
Get Quote |
