938 Records
Image Part Manufacturer Description MOQ Stock Action
HSB18-232310 CUI Devices
HEAT SINK, BGA, 23 X 23 X 10 MM
1
RFQ
5,414
In-stock
Get Quote
HSE-B250-04H CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1
RFQ
30,391
In-stock
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HSS03-B20-P318 CUI Devices
HEAT SINK, STAMPING, TO-220, 41.
1
RFQ
35,440
In-stock
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HSS02-B20-P318 CUI Devices
HEAT SINK, STAMPING, TO-220, 23.
1
RFQ
11,699
In-stock
Get Quote
HSB23-232325 CUI Devices
HEAT SINK, BGA, 23 X 23 X 25 MM
1
RFQ
21,505
In-stock
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HSS01-B20-CP CUI Devices
HEAT SINK, STAMPING, TO-220, 49.
1
RFQ
42,076
In-stock
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HSB14-353518 CUI Devices
HEAT SINK, BGA, 35 X 35 X 18 MM
1
RFQ
18,875
In-stock
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HSB16-404018 CUI Devices
HEAT SINK, BGA, 40 X 40 X 18 MM
1
RFQ
40,946
In-stock
Get Quote
HSB17-404025 CUI Devices
HEAT SINK, BGA, 40 X 40 X 25 MM
1
RFQ
26,894
In-stock
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HSS-B20-065V-02 CUI Devices
HEATSINK TO-220 2.9W ALUMINUM
1
RFQ
14,917
In-stock
Get Quote
2 / 47 Page, 938 Records